Fanless Design: How to Achieve Efficient Thermal Management in a Compact 150W Power Adapter?

1. Advanced Circuit Topology

Traditional single-stage flyback topologies face efficiency limitations at higher power levels. To achieve 93% or even higher efficiency in the 150W power range, YHYadapter has adopted more advanced two-stage architectures, such as PFC + LLC resonant designs.

• PFC stage: Corrects the power factor, ensuring compliance with harmonic requirements in global power grids.
• LLC stage: Achieves zero-voltage switching (ZVS) for the switching transistors, greatly reducing switching losses. This is the core technology for reducing heat generation and improving efficiency.

2. Use of High-Performance Power Semiconductors and Magnetic Components

a. CoolMOS Technology

YHYadapter chooses the CoolMOS semiconductor over traditional silicon-based MOSFETs. CoolMOS uses superjunction technology, improving conduction and switching losses. This results in lower temperature rise and higher reliability.

CoolMOS allows for high-efficiency, high-power density, and compact size in power supplies.

 

b. Low-Loss Magnetic Components

YHYadapter uses high-quality, low-loss ferrite cores and Litz wire to design transformers and inductors, reducing hysteresis losses and eddy current losses at high frequencies.

 

3. Scientific PCB Layout

YHYadapter uses thermal simulation software to optimize PCB layout. Heat-generating components are strategically placed to distribute heat evenly, avoiding hotspots. Additionally, the PCB itself acts as part of the heat sink, with large areas of copper and thermal vias to accelerate heat dissipation.

4. High-Efficiency Thermal Interface Materials

The small air gaps between components and heat sinks present a significant barrier to heat transfer. YHYadapter uses high-quality thermal paste or thermal gel to fill these gaps, improving heat transfer efficiency.

For areas requiring electrical insulation, high-performance thermal pads are used.

 

5. Fully Enclosed Design

YHYadapter’s fully enclosed aluminum alloy design helps dissipate heat effectively. Aluminum alloy rapidly conducts heat from internal components like transformers and power chips to the surface of the housing, where it is then dissipated by air convection.

This design prevents performance degradation or component damage due to overheating, while ensuring uniform heat dissipation.